“Connected Chips, Vehicles and Chains” – Automotive Grade Chip Ecological Cooperation Promotion Conference was held

On December 21^st, “Connected Chips, Vehicles and Chains” – Automotive Grade Chip Ecological Cooperation Promotion Conference jointly sponsored by Shanghai Integrated Circuit Industry Association and Hua Hong Group was held in Pudong. Wu Jincheng, Deputy Secretary-general of Shanghai Municipal People’s Government, Deputy Secretary of CPC Pudong New Area Committee and Acting District Head, and Tang Wenkan, Vice Chairman of Shanghai Municipal Commission of Economy and Informationization, attended and delivered speeches. Zhang Suxin, Chairman of Hua Hong Group, and Guo Yiwu, Secretary-general of Shanghai Integrated Circuit Industry Association, gave welcome speeches. Wu Qiang, Deputy District Head of Pudong New Area, and Zu Sijie, Vice President and Chief Engineer of SAIC, attended the event.

Mr. Tang pointed out that as a region with the advantages of both automobile and integrated circuit industries in China, Shanghai boasts 8 complete vehicle enterprises, more than 600 domestic and international major parts enterprises, and over 1,200 integrated circuit industry chain enterprises, and has issued 12 measures to support the development of automobile chip industry. In order to achieve the high-quality development of automobile chip industry, it always adheres to the momentum of terminal demand, continuously improves the chip supply capacity, and strives to optimize the industrial development ecology. In the next step, Shanghai Municipal Commission of Economy and Informatization will continue to focus on the deployment of the Ministry of Industry and Information Technology and the work requirements of CPC Shanghai Municipal Committee and Shanghai Municipal People’s Government, do a good job in the implementation of 12 automotive chip policies, continue to focus on the demand for complete vehicles, support key projects in the field of automotive chips, and continuously strengthen enterprise services and guarantees.

Nearly 100 enterprises including IP, EDA, design, packaging and testing in the fields of integrated circuits, complete vehicles and parts were invited to participate in the conference, aiming at jointly driving the ecological cooperation of automotive grade chips and promoting the coordinated development of the two major industries.